1. This equipment is developed and manufactured on an imported platform, targeting semiconductor power devices such as IGBT and other products that require vacuum soldering with solder paste or solder preforms.

2. This equipment adopts an industrial control embedded control system, which is not only stable and reliable but also provides more precise temperature control.

3. The equipment supports recipe functionality for key soldering parameters and supports SECS/GEM data exchange.

4. The equipment can automatically and visually adjust the vacuum pump‘s evacuation speed and set staged vacuum evacuation based on different products, preventing component shifting and solder ball formation during soldering.

5. The water-cooled sealing ring structure offers longer service life, lower operating costs, and reduces expensive product damage caused by poor sealing.

6. Maximum vacuum level reaches 0.1 kPa, with single void <1% and total void <2%.

7. The precise quantitative formic acid and nitrogen control system not only significantly saves nitrogen and formic acid but also effectively reduces residual formic acid emissions.

8. The equipment adopts an automatic inspection system that can detect operating conditions in advance, predict potential failures, and eliminate faults proactively.

9. This equipment is a perfect replacement for PINK formic acid vacuum reflow soldering systems.