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Semiconductor solidification vertical furnace

Silver paste curing vertical furnace

Primarily used for pre-curing / drying (debinding) of nano-silver paste—not for pressure-assisted silver sintering; also used for underfill, epoxy, and conformal coating curing.
Commonly used for pre-curing and debinding after nano-silver paste printing in power semiconductors: slowly evaporating most of the solvent in the silver paste to prevent bubbling, porosity, and other defects during subsequent sintering.
Significantly extends process time while enabling continuous inline production.
Compact footprint with high space utilization.
Hot-air convection heating with excellent temperature uniformity.
Fully automatic inline connection to production lines.
Optional atmosphere control with nitrogen protection available.

    Main Technical Specifications

    No.

    Parameter

    Specification

    1

    Model

    HX-F420N

    2

    Equipment Dimensions (mm)

    2130(L)×1450mm(W)×2250mm(H)

    3

    Machine Weight

    APPROX: 2000 KG

    4

    Fixture Dimensions (mm)

    L 180 mm × D 170 MM × H 5 mm

    5

    Number of Heating Zones

    4 zones (2 upper, 2 lower)

    6

    Exhaust Requirement

    5 m³/H

    7

    Power Supply Requirements

    3P 380V/220/480 50/60Hz

    8

    Total Power

    45 KW

    9

    Power Consumption

    7 KW

    10

    Hot Air Speed Control

    Variable frequency drive

    11

    Heat-Up Time

    APPROX: 15–30 min

    12

    Curing Temperature

    ≤200°C

    13

    Temperature Control Method

    PID closed-loop control + high-frequency pulse

    14

    Temperature Control Accuracy

    ±1.0°C

    15

    Heating Zone Temperature Deviation

    ±2.0°C

    16

    Furnace Outer Surface Temperature

    ≤50°C

    17

    Parameter Storage

    Multiple production parameter sets can be stored

    18

    Single-Layer Chain Load Capacity

    5 KG

    19

    Total System Load Capacity

    250 KG

    20

    Transport Direction

    Standard left to right

    21

    Fixture Edge Support Width

    ≥5 mm

    22

    Signal Interface

    Board input from upstream / output to downstream

    23

    Conveyor Motor

    Servo / Stepper motor

    24

    Pusher Motor

    Stepper motor

    25

    Input/Output Height (mm)

    900 ± 20

    26

    Production Efficiency

    60 min / baking time (min) × number of board storage layers

    27

    Number of Layers

    48 (spacing 31.75 mm)

    28

    Baking Time

    8 min – 10,000 min, programmable

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