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Semiconductor solidification vertical oven

Silver paste curing vertical oven

1.Primarily used for pre-curing / drying (debinding) of nano-silver paste—not for pressure-assisted silver sintering; also used for underfill, epoxy, and conformal coating curing.
2.Commonly used for pre-curing and debinding after nano-silver paste printing in power semiconductors: slowly evaporating most of the solvent in the silver paste to prevent bubbling, porosity.
3.Significantly extends process time while enabling continuous inline production.
4.Compact footprint with high space utilization.
5.Hot-air convection heating with excellent temperature uniformity.
6.Fully automatic inline connection to production lines.
7.Optional atmosphere control with nitrogen protection available.

    Main Technical Specifications

    No.

    Parameter

    Specification

    1

    Model

    HX-F420N

    2

    Equipment Dimensions (mm)

    2130(L)×1450mm(W)×2250mm(H)

    3

    Machine Weight

    APPROX: 2000 KG

    4

    Fixture Dimensions (mm)

    L 180 mm × D 170 MM × H 5 mm

    5

    Number of Heating Zones

    4 zones (2 upper, 2 lower)

    6

    Exhaust Requirement

    5 m³/H

    7

    Power Supply Requirements

    3P 380V/220/480 50/60Hz

    8

    Total Power

    45 KW

    9

    Power Consumption

    7 KW

    10

    Hot Air Speed Control

    Variable frequency drive

    11

    Heat-Up Time

    APPROX: 15–30 min

    12

    Curing Temperature

    ≤200°C

    13

    Temperature Control Method

    PID closed-loop control + high-frequency pulse

    14

    Temperature Control Accuracy

    ±1.0°C

    15

    Heating Zone Temperature Deviation

    ±2.0°C

    16

    Furnace Outer Surface Temperature

    ≤50°C

    17

    Parameter Storage

    Multiple production parameter sets can be stored

    18

    Single-Layer Chain Load Capacity

    5 KG

    19

    Total System Load Capacity

    250 KG

    20

    Transport Direction

    Standard left to right

    21

    Fixture Edge Support Width

    ≥5 mm

    22

    Signal Interface

    Board input from upstream / output to downstream

    23

    Conveyor Motor

    Servo / Stepper motor

    24

    Pusher Motor

    Stepper motor

    25

    Input/Output Height (mm)

    900 ± 20

    26

    Production Efficiency

    60 min / baking time (min) × number of board storage layers

    27

    Number of Layers

    48 (spacing 31.75 mm)

    28

    Baking Time

    8 min – 10,000 min, programmable

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